Munich, Germany – 28 July 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs). Housed in a compact PG-DSO-8 150 mil package with a footprint comparable to existing PVI solutions, the new family gives designers a direct upgrade path to SSI technology in space-constrained designs while benefiting from higher drive capability, integrated protection features and flexibility in power-switch selection. Target applications include solid-state relay modules, PLC input/output, industrial automation, laboratory DC power supplies, automated test equipment, low-voltage building automation, and telecom infrastructure.The ISSI20BxxF family is built on Infineon's proprietary coreless-transformer technology, which transfers both signal and energy across the isolation barrier to drive external power switches without requiring a dedicated isolated gate supply. This approach delivers higher output-drive capability than conventional PVI-based solutions, enabling compatibility with a broad range of external power switches. Integrated protection functions include over-current protection, over-temperature protection, fast fault turn-off, and latch-off capability, reducing the need for external protection circuitry and improving system robustness. Selected variants additionally support dynamic Miller clamp and fast turn-on functionality for applications with more demanding switching requirements.The family comprises three devices, the ISSI20B02F, ISSI20B03F, and ISSI20B11F, all housed in the PG-DSO-8 150 mil package. All three devices provide 3 kVrms isolation, 4 mm creepage, and UL 1577 certification, covering applications where basic isolation is appropriate under applicable safety standards. The ISSI20BxxF family complements Infineon's previously introduced ISSI20RxxH and ISSI30RxxH families, extending the SSI portfolio to designs where a smaller footprint is required. Compared with electromechanical relays, SSI-based solid-state relays eliminate mechanical wear, contact bounce, and arcing, enabling silent operation and long service life, characteristics that are increasingly valued in high-cycle applications.AvailabilityThe ISSI20B02F, ISSI20B03F, and ISSI20B11F are available now. Evaluation hardware, application notes, technical training materials, and design support resources are available. More information is available at www.infineon.com/ssi

Common GNSS Integration Mistakes Every Engineer Should Know Every engineer has faced it: you selected a high-performance GNSS receiver and a certified antenna, yet your device is still failing field tests. Why? The answer often comes down to antenna design and integration - decisions that are frequently overlooked early in a project. By prioritizing antenna choices from the start, you can reduce costs, accelerate development, and avoid integration headaches down the line. To help, we've created a series of practical guides to empower you to make informed antenna decisions - long before issues become expensive setbacks. At Taoglas, we've collaborated with engineering teams worldwide to eliminate late-stage surprises by focusing on effective antenna integration from day one. Whether your goal is cost savings, peak performance, or rapid time to market, we’re ready to help you succeed. Essential Knowledge Guides Understanding Ground Planes Learn more Mitigating Interference in GNSS Devices Learn more 

Munich, Germany – 29 July 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its automotive power distribution portfolio with the SPOC™ Wire Guard BTS80009 SWPx 1ES, a highly integrated 12 V automotive eFuse with SPI interface. As the first member of a new smart power switch family, it combines a protected high-side switch with integrated I²t wire protection, software configurability, and advanced diagnosis. It is designed for new E/E architectures that support software-defined vehicle (SDV) concepts with over-the-air updates.The SPOC Wire Guard BTS80009 SWPx 1ES automotive eFuse provides ultrafast failure isolation in µs as well as precise current sensing, avoiding overdimensioning of the wire diameter compared with traditional melting fuses. At the same time, it ensures high availability of the power supply with freedom of interference. For permanently powered loads, the product features a dedicated idle mode with very low power consumption of only a few µA while maintaining full protection. To mitigate a limited amount of microcontroller I/O ports, its 24-bit SPI interface is daisy-chain-capable. To support platform reuse across vehicle variants, configuration, and protection parameters can be adjusted in software for each variant. In addition, SPOC Wire Guard devices provide real-time status, pre-warning indicators, and other diagnostics to improve vehicle availability and enable optimization throughout the vehicle’s lifecycle.SPOC Wire Guard also addresses growing needs for features supporting Advanced Driver Assistance Systems (ADAS) and enables fail-operational capabilities for L2++ to L5. It is offered as a Safety Element out of Context (SEooC) for use in systems up to ASIL-D in accordance with ISO 26262, with an integrated non-volatile memory (NVM) to configure an application-specific safe state. It can autonomously react to supply-voltage drops caused by load faults to protect the supply. The single-channel architecture helps prevent fault propagation to other outputs.The first family member, SPOC Wire Guard BTS80009 SWPx 1ES, is available in four variants with a scalable feature set (A, I, P, and F) and supports currents up to 34.5 A, making it suitable for replacing gate-driver ICs plus MOSFET and shunt solutions and delivering significant PCB savings.AvailabilityThe BTS80009 SWPx 1ES is now in production, with three further RDS (on) variants planned to follow by the end of 2026. Further information is available at www.infineon.com/spocwireguard.

Munich, Germany – 25 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the AIROC™ UWB TSL100, the company’s first-generation ultra-wideband (UWB) product family for precise positioning and smart presence detection. As part of Infineon’s AIROC portfolio, the TSL100 features a new architecture aimed at reducing power consumption and enhancing security. The product family marks the start of a scalable UWB platform intended to support future standards such as IEEE 802.15.4ab and is compliant with industry consortium standards such as CCC, Aliro, and FiRa. The TSL100 combines ranging and sensing capabilities in a single device, enabling applications such as secured vehicle access, in-cabin presence detection, access control, contactless payment, ticketing, and indoor navigation, as well as industrial use cases including asset tracking and collision avoidance. With the introduction of the AIROC™ UWB TSL100, Infineon strengthens its position in secured connected systems and expands its AIROC™ wireless portfolio with a new family of UWB devices. These devices combine precise positioning and smart presence detection on a single chip, addressing growing demand across automotive, consumer, and industrial markets.Vehicle and building access systems as well as asset tracking and indoor navigation require very low power operation, reliable and robust RF performance to resolve non-line of sight scenarios like back pocket situations. Moreover, users and administrators demand highest security levels to avoid man-in-the-middle attacks. “Our AIROC UWB portfolio addresses these challenges by combining low power consumption, excellent first-path dynamic range and provable physical- and application-layer security. As a result, the first-generation AIROC UWB TSL100 SoC enables seamless access, positioning, and sensing capabilities while reducing system complexity,” said Maurizio Skerlj, Senior Vice President Authentication and Identity Solutions at Infineon. Enabling Secured Access and Digital Key ApplicationsThe AIROC UWB TSL100 product family comes in two variants: the TSL111A (AEC-Q100) for automotive OEMs and Tier-1 suppliers, and the TSL111C for consumer and industrial applications. The automotive variant targets use cases such as CCC Digital Key™, key fobs, NCAP-compliant presence detection, kick sensing, and intrusion detection, while the consumer and industrial variant supports smart access, asset tracking, tap-free payment, “find” applications, and indoor navigation. The integration of ranging and sensing on a single device reduces system complexity by eliminating the need for separate sensing subsystems in many applications.The AIROC UWB TSL100 offers the following key advantages for UWB implementations:Low power consumption: A low-power design achieves coin-cell battery lifetime of more than two years in CCC ranging schemes for key fobs. A dedicated low-power mode further reduces current consumption by more than 50 percent. Efficient Security: The PHY design enables highest FiRa/CCC security levels (48-bit) in challenging non-line-of-sight conditions, such as back-pocket scenarios. The system can detect and verify the security status of weak direct paths up to 100,000 times weaker than reflected paths.Cost-Optimized Sensing: The RF architecture supports sensing functions for applications such as presence detection, supporting NCAP scenarios as well as kick sensing and intrusion detection.AIROC Zoning: AIROC intent detection technology provides a system-level solution for configurable unlock zones as well as inside/outside detection for reliable access control performance while extending battery life for Aliro-enabled smart locks.The AIROC UWB TSL100 will be supported by an engineering sample kit that provides developers with access to Infineon’s latest UWB technology for rapid prototyping of secured access and sensing applications. The kit supports system-level evaluation, including ranging accuracy, sensing coverage, and power consumption, and helps accelerate hardware and software co-development, reducing time-to-market for next-generation UWB-enabled products.AvailabilityEngineering sample kits for the AIROC UWB TSL100 are available upon request. More information is available at www.infineon.com/airoc-uwb.