Our emphasis on innovation is not only recognizable in the variety of frame-based power modules, but also in the HybridPACK™ DSC. Thanks to its double side cooling technology and half-bridge configuration, this power module is the ideal solution for compact, flexible and integrated Si-based main inverter designs up to 75 kW. Two copper plates on both sides of the module are used for double-sided cooling (DSC) and herewith enable high power density. On chip temperature and current sensors (overcurrent protection) offer a good compromise between security and performance. HybridPACK™ DSC modules offer scalability to support customers’ platform approach.

Infineon believes in Si IGBT and SiC MOSFET technology complementing each other and therefore will launch the next generation of HybridPACK™ DSC in 2023 with a CoolSiC™ chipset. This module will deliver up to double the performance compared to Si-based DSC-S solutions ceteris paribus.